Wurth Elektronik WE-TGF Series Thermal Gap Pad, 500 μm Thick, 2 W/mK, 100 mm, 100mm, Ceramic Filled Silicone Rubber

This thermal gap pad provides a compliant Interface to improve heat transfer between uneven surfaces in electronic assemblies. It is MADE from a ceramic-filled silicone elastomer designed to conform to component and heatsink irregularities while remaining operational across a wide temperature range. The pad’s moderate hardness suits applications requiring a balance between mechanical support and thermal contact.

• 2W/mK thermal conductivity enhances heat dissipation
• 45 Shore C hardness maintains mechanical stability under compression
• -50°C minimum operating temperature supports cold-start environments
• 180°C maximum operating temperature enables high-temperature use
• RoHS and REACH approvals ensure restricted-substance compliance

• Suitable for bridging Air gaps in power modules
• Ideal for use in thermal management of LED arrays
• Used with densely packed control electronics for cooling
• Can be used for gap filling in automotive electronics

It is constructed from ceramic-filled silicone rubber that combines thermal fillers with a compliant polymer matrix.

The filler formulation delivers thermal conduction while the silicone Matrix retains dielectric characteristics suitable for isolated interfaces.

The product is supplied as sheets measuring 100x100mm and can be cut to required shapes.

The material meets halogen-free specifications per JEDEC JS709B and IEC 61249-2-21 and is REACH compliant.