Bergquist TGP 2000 Series Self-Adhesive Thermal Gap Pad, 0.04in Thick, 2W/m·K, Silicone, 16 x 8 x 0.04in
- RS-stocknr.:
- 282-6744
- Fabrikantnummer:
- GAP PAD TGP 2000, 16in x 8in x 0.04 sh
- Fabrikant:
- Bergquist
tijdelijk niet op voorraad – nieuwe voorraad verwacht op 16-09-2024, met een levertijd van 2 à 3 werkdagen.
Prijs Per stuk
€ 84,22
(excl. BTW)
€ 101,91
(incl. BTW)
Aantal stuks | Per stuk |
|---|---|
| 1 + | € 84,22 |
- RS-stocknr.:
- 282-6744
- Fabrikantnummer:
- GAP PAD TGP 2000, 16in x 8in x 0.04 sh
- Fabrikant:
- Bergquist
Wetgeving en compliance
N.v.t.
- Land van herkomst:
- US
Productomschrijving
The Bergquist Highly Conformable, Thermally Conductive, Reinforced S-Class Gap Filling Material. It is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.
Highly Conformable
Low hardness
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance
Low hardness
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance
Specificaties
Kenmerk | Waarde |
|---|---|
| Dimensions | 16 x 8 x 0.04in |
| Thickness | 0.04in |
| Length | 16in |
| Width | 8in |
| Thermal Conductivity | 2W/m·K |
| Material | Silicone |
| Self-Adhesive | Yes |
| Series | TGP 2000 |