Bergquist 3500UL Series Self-Adhesive Thermal Gap Pad, 3.1 mm Thick, 3.5 W/mK, Silicone
- RS-stocknr.:
- 282-6784
- Fabrikantnummer:
- GAP PAD TGP 3500ULMG (2166909)
- Fabrikant:
- Bergquist
Subtotaal (1 eenheid)*
€ 209,86
(excl. BTW)
€ 253,93
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Tijdelijk niet op voorraad
- Verzending vanaf 17 juli 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 + | € 209,86 |
*prijsindicatie
- RS-stocknr.:
- 282-6784
- Fabrikantnummer:
- GAP PAD TGP 3500ULMG (2166909)
- Fabrikant:
- Bergquist
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 3.1mm | |
| Thermal Conductivity | 3.5W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Silicone | |
| Standards/Approvals | No | |
| Series | 3500UL | |
| Alles selecteren | ||
|---|---|---|
Merk Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 3.1mm | ||
Thermal Conductivity 3.5W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Silicone | ||
Standards/Approvals No | ||
Series 3500UL | ||
Vrijgesteld
The Bergquist is an extremely soft gap filling material with a thermal conductivity of 3.5 W per mK. The material offers exceptional thermal performance at low pressures due to a unique 3.5 W per mK filler package and ultra-low modulus resin formulation. The enhanced material is well suited for high performance applications requiring extremely low assembly stress. It maintains a conformable nature that allows for excellent interfacing and wet out characteristics, even to surfaces with high roughness and or topography.
Fiberglass reinforced for shear and tear resistance
Non-fiberglass option for applications that require an additional reduction in stress
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