Bergquist 1600S Series Self-Adhesive Thermal Interface Pad, 0.009 in Thick, 1.6 W/mK, 12 in, 12in, Silicone
- RS-stocknr.:
- 282-6863
- Fabrikantnummer:
- SIL PAD TSP 1600S, 12in x 12in x 0.009 eaac
- Fabrikant:
- Bergquist
Subtotaal (1 eenheid)*
€ 51,72
(excl. BTW)
€ 62,58
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Tijdelijk niet op voorraad
- Verzending vanaf 08 december 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 + | € 51,72 |
*prijsindicatie
- RS-stocknr.:
- 282-6863
- Fabrikantnummer:
- SIL PAD TSP 1600S, 12in x 12in x 0.009 eaac
- Fabrikant:
- Bergquist
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Bergquist | |
| Product Type | Thermal Interface Pad | |
| Thickness | 0.009in | |
| Thermal Conductivity | 1.6W/mK | |
| Self-Adhesive | Yes | |
| Trade Name | 1600S | |
| Conductive Material | Silicone | |
| Standards/Approvals | No | |
| Length | 12in | |
| Width | 12in | |
| Series | 1600S | |
| Alles selecteren | ||
|---|---|---|
Merk Bergquist | ||
Product Type Thermal Interface Pad | ||
Thickness 0.009in | ||
Thermal Conductivity 1.6W/mK | ||
Self-Adhesive Yes | ||
Trade Name 1600S | ||
Conductive Material Silicone | ||
Standards/Approvals No | ||
Length 12in | ||
Width 12in | ||
Series 1600S | ||
Vrijgesteld
- Land van herkomst:
- US
The Bergquist thermally conductive insulation material is designed for a wide variety of applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping. The material combines a smooth and highly compliant surface characteristic with high thermal conductivity. These features optimize the thermal resistance properties at low pressure.
Electrically isolating
Low mounting pressures
Smooth and highly compliant surface
General-purpose thermal interface material solution
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