Bergquist GP2200SF Series Self-Adhesive Thermal Interface Sheet, 3.175 mm Thick, 2 W/mK, 200 mm, 100mm, Gap Pad 2200SF
- RS-stocknr.:
- 752-4865
- Fabrikantnummer:
- GP2200SF-0.040-02-00-200x100
- Fabrikant:
- Bergquist
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We weten niet of dit item nog op voorraad komt, RS is van plan dit binnenkort uit ons assortiment te halen.
- RS-stocknr.:
- 752-4865
- Fabrikantnummer:
- GP2200SF-0.040-02-00-200x100
- Fabrikant:
- Bergquist
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Bergquist | |
| Product Type | Thermal Interface Sheet | |
| Thickness | 3.175mm | |
| Thermal Conductivity | 2W/mK | |
| Self-Adhesive | Yes | |
| Trade Name | Gap Pad 2200SF | |
| Hardness | Shore OO 70 | |
| Conductive Material | Gap Pad 2200SF | |
| Width | 100mm | |
| Standards/Approvals | RoHS | |
| Length | 200mm | |
| Colour | Green | |
| Minimum Operating Temperature | -60°C | |
| Series | GP2200SF | |
| Maximum Operating Temperature | 125°C | |
| Alles selecteren | ||
|---|---|---|
Merk Bergquist | ||
Product Type Thermal Interface Sheet | ||
Thickness 3.175mm | ||
Thermal Conductivity 2W/mK | ||
Self-Adhesive Yes | ||
Trade Name Gap Pad 2200SF | ||
Hardness Shore OO 70 | ||
Conductive Material Gap Pad 2200SF | ||
Width 100mm | ||
Standards/Approvals RoHS | ||
Length 200mm | ||
Colour Green | ||
Minimum Operating Temperature -60°C | ||
Series GP2200SF | ||
Maximum Operating Temperature 125°C | ||
- Land van herkomst:
- US
Gap Pad® 2200SF
Gap Pad® 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad® 2200SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides. Gap Pad® 2200SF is supplied with reduced tack on one side allowing for burn-in processes and easy rework. Typical applications include digital disk drives, proximity near electrical contacts (e.g. DC brush motors, connectors, relays) and fibre optics modules.
Thermal conductivity: 2.0 W/m-K
Silicone-free formulation
Medium compliance with easy handling
Electrically isolating
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