TE Connectivity 0.93 mm Pitch 4677 Way LGA Surface Prototyping IC Socket
- RS-stocknr.:
- 267-4874
- Fabrikantnummer:
- 2-2347090-1
- Fabrikant:
- TE Connectivity
Informatie over voorraden is momenteel niet toegankelijk
- RS-stocknr.:
- 267-4874
- Fabrikantnummer:
- 2-2347090-1
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Package Type | LGA | |
| Product Type | IC Socket | |
| IC Socket Type | Prototyping Socket | |
| Number of Contacts | 4677 | |
| Current | 500mA | |
| Pitch | 0.93mm | |
| Orientation | Straight | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Device Mount Type | Surface | |
| Minimum Operating Temperature | -40°C | |
| Socket Mount Type | Surface | |
| Maximum Operating Temperature | 105°C | |
| Standards/Approvals | RoHS, UL 94V-0 | |
| Housing Material | Liquid Crystal Polymer | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Package Type LGA | ||
Product Type IC Socket | ||
IC Socket Type Prototyping Socket | ||
Number of Contacts 4677 | ||
Current 500mA | ||
Pitch 0.93mm | ||
Orientation Straight | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Device Mount Type Surface | ||
Minimum Operating Temperature -40°C | ||
Socket Mount Type Surface | ||
Maximum Operating Temperature 105°C | ||
Standards/Approvals RoHS, UL 94V-0 | ||
Housing Material Liquid Crystal Polymer | ||
- Land van herkomst:
- CN
The TE Connectivity new LGA 4677 sockets for top processor players are designed with high bandwidth demands with PCI express and DDR5 8 channel support available as well as providing a much larger amount of memory channels. When partnered with TE Connectivity DDR5 DIMM socket solutions and PCI express generation 5. The TE LGA 4677 socket provides a total solution for supporting the data rates required by next generation system architectures.
Increased performance
Supports auto assembly processes
Reduced overall power consumption
Greater number of memory channels
Supports higher speed networking protocols
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