Infineon ISG N-Channel Power Transistor, 139 A, 100 V Enhancement, 10-Pin PG-WHITFN-10-1 ISG0616N10NM5HSCATMA1

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RS-stocknr.:
349-152
Fabrikantnummer:
ISG0616N10NM5HSCATMA1
Fabrikant:
Infineon
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Merk

Infineon

Channel Type

N

Product Type

Power Transistor

Maximum Continuous Drain Current Id

139A

Maximum Drain Source Voltage Vds

100V

Package Type

PG-WHITFN-10-1

Series

ISG

Mount Type

Surface

Pin Count

10

Maximum Drain Source Resistance Rds

4mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

52nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

167W

Forward Voltage Vf

1V

Maximum Gate Source Voltage Vgs

20V

Maximum Operating Temperature

175°C

Standards/Approvals

IEC61249-2-21, RoHS

Automotive Standard

No

Land van herkomst:
MY

Infineon ISG Series Power Transistor, 100V Drain Source Voltage, 139A Continuous Drain Current - ISG0616N10NM5HSCATMA1


This power transistor is a high-current N-channel enhancement MOSFET designed for surface-mount applications where efficient switching and thermal endurance are required. It operates across a wide temperature span and is intended for power-conversion and high-current switching contexts, offering a balance between low conduction losses and significant heat-handling capability.

Features and Benefits:


• 100V drain rating enables high-voltage switching capability
• 4mΩ Rds(on) reduces conduction losses under heavy load
• 139A continuous current supports high-current designs
• 167W power dissipation assists sustained thermal loads
• 52nC gate charge enables predictable switching performance
• Surface-mount PG-WHITFN-10-1 package simplifies automated assembly

Applications


• Suitable for high-current DC-DC converters in power supplies
• Ideal for synchronous rectification in power management
• Used with motor-drive stages requiring high continuous current
• Can be used for server and telecom power distribution units
• Appropriate for industrial switching where elevated temperatures occur

What gate-drive considerations are necessary for efficient switching?


The typical gate charge of 52nC at the specified gate voltage requires a driver capable of sourcing and sinking sufficient peak current to achieve the desired rise and fall times while managing switching losses.

How does the device handle thermal stress in compact layouts?


With 167W maximum dissipation, the thermal layout should include adequate copper area and thermal vias beneath the package to spread heat and maintain junction temperatures within limits.

What voltage limits must be observed to avoid device damage?


The maximum drain-source voltage is 100V and the gate-source voltage must not exceed 20V to prevent avalanche or gate-oxide stress.

How robust is the device for deployments in extreme ambient conditions?


It operates across a temperature range from -55°C up to 175°C, allowing use in environments with severe temperature variation.

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