Vishay IRFS9N60A Type N-Channel Power MOSFET, 9.2 A, 600 V Enhancement, 3-Pin TO-263

Subtotaal (1 tube van 50 eenheden)*

€ 91,80

(excl. BTW)

€ 111,10

(incl. BTW)

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50 +€ 1,836€ 91,80

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RS-stocknr.:
178-0850
Fabrikantnummer:
IRFS9N60APBF
Fabrikant:
Vishay
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Merk

Vishay

Product Type

Power MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

9.2A

Maximum Drain Source Voltage Vds

600V

Package Type

TO-263

Series

IRFS9N60A

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

750mΩ

Channel Mode

Enhancement

Forward Voltage Vf

1.5V

Minimum Operating Temperature

-55°C

Maximum Gate Source Voltage Vgs

30V

Maximum Power Dissipation Pd

170W

Typical Gate Charge Qg @ Vgs

49nC

Maximum Operating Temperature

150°C

Length

10.67mm

Height

4.83mm

Standards/Approvals

RoHS

Width

9.65mm

Automotive Standard

No

Vishay IRFS9N60A Series Power MOSFET, 600V Maximum Drain Source Voltage, 9.2A Maximum Continuous Drain Current - IRFS9N60APBF


This power MOSFET is a high-voltage N-channel device designed for switching and power conversion tasks in industrial and electronic systems. It operates across a wide temperature range and is intended for surface-mount integration on power assemblies where high-voltage capability and robust thermal handling are required.

Features and Benefits:


• 600V drain withstand voltage enabling high-voltage switching
• 9.2 A continuous drain current for steady load handling
• 750 mΩ on-resistance minimises conduction losses
• 49 nC typical gate charge for predictable switching energy
• 170W power dissipation supports elevated power throughput
• 150 °C maximum junction temperature for high-temperature operation

Applications


• Suitable for SMPS primary switch functions in power supplies
• Ideal for high-voltage inverter stages in industrial drives
• Used for switch-mode motor controllers handling elevated voltages
• Can be used for power-factor correction front-end circuits

What mounting format does it require for assembly?


It is supplied for surface mounting in a TO-263 package with three pins to suit standard heat-sinked PCB footprints.

What gate limits must be observed to avoid damage?


The gate must not be driven beyond ±30V relative to source to prevent gate oxide overstress.

How does thermal management influence performance?


With 170W rated dissipation and a 150 °C maximum junction temperature, adequate PCB copper and heatsinking are needed to maintain junction temperature under heavy load.

What environmental specification affects materials selection?


The component conforms to RoHS requirements, influencing soldering and material choices in assembly.

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