Vishay Si2325DS Type P-Channel MOSFET, -530 mA, -150 V Enhancement, 3-Pin SOT-23 SI2325DS-T1-E3

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RS-stocknr.:
919-0275
Fabrikantnummer:
SI2325DS-T1-E3
Fabrikant:
Vishay
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Merk

Vishay

Product Type

MOSFET

Channel Type

Type P

Maximum Continuous Drain Current Id

-530mA

Maximum Drain Source Voltage Vds

-150V

Series

Si2325DS

Package Type

SOT-23

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

1.2Ω

Channel Mode

Enhancement

Maximum Power Dissipation Pd

750mW

Forward Voltage Vf

-1.2V

Maximum Gate Source Voltage Vgs

-20V, +20V

Minimum Operating Temperature

-55°C

Typical Gate Charge Qg @ Vgs

7.7nC

Maximum Operating Temperature

150°C

Width

1.4mm

Height

1.02mm

Standards/Approvals

RoHS

Length

3.04mm

Automotive Standard

No

Land van herkomst:
CN

Vishay Si2325DS Series MOSFET, 150V Maximum Drain Source Voltage, 750mW Maximum Power Dissipation - SI2325DS-T1-E3


This p-channel MOSFET is a surface-mount semiconductor designed for high-voltage switching in compact electronic assemblies. It operates as an enhancement-mode transistor suitable for low-power applications where controlled source-to-drain conduction and gate-driven switching are required. The device meets RoHS requirements and is specified for a broad temperature range, making it appropriate for varied electronic environments.

Features and Benefits:


• High voltage capability supports switching up to -150V
• Low on-resistance delivers 1.2Ω for efficient conduction
• Continuous drain current rating allows -530mA steady operation
• Limited power loss with 750mW maximum dissipation
• Small gate charge of 7.7nC enables faster gate transitions
• Wide operating temperature range spans -55°C to 150°C

Applications


• Suitable for high-voltage load switching in power rails
• Ideal for level-shift circuits requiring P-channel devices
• Used with battery protection and reverse-polarity circuits
• Suitable for compact surface-mount power-management boards
• Can be used for low-power MOSFET roles in signal switching

What package and mounting method does it use?


It is supplied in a SOT-23 package intended for surface mounting to save board space.

What gate voltage limits should be observed during design?


The gate-to-source voltage must not exceed 20V to avoid gate overstress.

How should thermal considerations be handled in PCB layouts?


With a 750mW dissipation limit, provide adequate copper area or thermal vias to spread heat and maintain temperature within the specified -55°C to 150°C range.

Is this component rated for automotive specification levels?


It is not classified as automotive-grade

designers should not assume automotive qualification.

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