Bergquist 1100SF Series Self-Adhesive Thermal Gap Pad, 0.04in Thick, 0.9W/m·K, TIM, 8 x 16 x 0.04in

The Bergquist Thermally Conductive, Silicone-Free Gap Filling Material. It is a thermally conductive, electrically insulating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with high standoff and flatness tolerances. It is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides of the material. The topside has reduced tack for ease of handling.

No silicone outgassing
No silicone extraction
Reduced tack on one side to aid in application assembly
Electrically isolating