Bergquist 6000UL Series Self-Adhesive Thermal Gap Pad, 0.125 in Thick, 6 W/mK, 16 in, 8in, Silicone
- RS-stocknr.:
- 282-6792
- Fabrikantnummer:
- GAP PAD TGP 6000ULM, 16in x 8in x 0.125 sh
- Fabrikant:
- Bergquist
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- RS-stocknr.:
- 282-6792
- Fabrikantnummer:
- GAP PAD TGP 6000ULM, 16in x 8in x 0.125 sh
- Fabrikant:
- Bergquist
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.125in | |
| Thermal Conductivity | 6W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Silicone | |
| Length | 16in | |
| Standards/Approvals | No | |
| Width | 8in | |
| Series | 6000UL | |
| Alles selecteren | ||
|---|---|---|
Merk Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.125in | ||
Thermal Conductivity 6W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Silicone | ||
Length 16in | ||
Standards/Approvals No | ||
Width 8in | ||
Series 6000UL | ||
Vrijgesteld
- Land van herkomst:
- US
The Bergquist is an extremely soft gap filling material rated at a thermal conductivity of 6.0 W per mK. It is specially formulated for high performance applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. It is highly conformal, even to surfaces with high roughness or topography, allowing for excellent interfacing and wet-out characteristics.
High-compliance
Low compression stress
Ultra low modulus
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