Bergquist HC3000 Series Self-Adhesive Thermal Gap Pad, 0.1 in Thick, 3 W/mK, 8 in, 16in, Silicone
- RS-stocknr.:
- 282-6828
- Fabrikantnummer:
- GAP PAD TGP HC3000, 8in x 16in x 0.1
- Fabrikant:
- Bergquist
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- RS-stocknr.:
- 282-6828
- Fabrikantnummer:
- GAP PAD TGP HC3000, 8in x 16in x 0.1
- Fabrikant:
- Bergquist
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.1in | |
| Thermal Conductivity | 3W/mK | |
| Self-Adhesive | Yes | |
| Trade Name | HC3000 | |
| Conductive Material | Silicone | |
| Width | 16in | |
| Standards/Approvals | No | |
| Length | 8in | |
| Series | HC3000 | |
| Alles selecteren | ||
|---|---|---|
Merk Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.1in | ||
Thermal Conductivity 3W/mK | ||
Self-Adhesive Yes | ||
Trade Name HC3000 | ||
Conductive Material Silicone | ||
Width 16in | ||
Standards/Approvals No | ||
Length 8in | ||
Series HC3000 | ||
Vrijgesteld
- Land van herkomst:
- US
The Bergquist soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0 W per m K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly.
High-compliance and low compression stress
Fiberglass reinforced for shear and tear resistance
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- Bergquist HC3000 Series Self-Adhesive Thermal Gap Pad 3 W/mK 8in, Silicone
- Bergquist HC3000 Series Self-Adhesive Thermal Gap Pad 3 W/mK 8in, Silicone
- Bergquist HC3000 Series Self-Adhesive Thermal Gap Pad 3 W/mK 8in, Silicone
- Bergquist HC3000 Series Self-Adhesive Thermal Gap Pad 3 W/mK 8in, Silicone
- Bergquist HC3000 Series Self-Adhesive Thermal Gap Pad 3 W/mK 8in, Silicone