Bergquist 1100ST Series Self-Adhesive Thermal Interface Pad, 0.012 in Thick, 1.1 W/mK, 12 in, 12in, Silicone
- RS-stocknr.:
- 282-6852
- Fabrikantnummer:
- SIL PAD TSP 1100ST, 12in x 12in x 0.012
- Fabrikant:
- Bergquist
Subtotaal (1 eenheid)*
€ 68,37
(excl. BTW)
€ 82,73
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Tijdelijk niet op voorraad
- Verzending vanaf 22 januari 2027
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Aantal stuks | Per stuk |
|---|---|
| 1 + | € 68,37 |
*prijsindicatie
- RS-stocknr.:
- 282-6852
- Fabrikantnummer:
- SIL PAD TSP 1100ST, 12in x 12in x 0.012
- Fabrikant:
- Bergquist
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Bergquist | |
| Product Type | Thermal Interface Pad | |
| Thickness | 0.012in | |
| Thermal Conductivity | 1.1W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Silicone | |
| Standards/Approvals | No | |
| Width | 12in | |
| Length | 12in | |
| Series | 1100ST | |
| Alles selecteren | ||
|---|---|---|
Merk Bergquist | ||
Product Type Thermal Interface Pad | ||
Thickness 0.012in | ||
Thermal Conductivity 1.1W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Silicone | ||
Standards/Approvals No | ||
Width 12in | ||
Length 12in | ||
Series 1100ST | ||
Vrijgesteld
- Land van herkomst:
- US
The Bergquist fiberglass-reinforced thermal interface material featuring inherent tack on both sides. The material exhibits excellent thermal performance at low mounting pressures. It is supplied on two liners for exceptionally easy handling prior to auto-placement in high volume assemblies. It is ideal for placement between an electronic power device and its heat sink.
Inherent tack on both sides for exceptional thermal performance and easy placement
Re-positionable for higher utilization, ease of use and assembly error reduction
Lined on both sides for ease of handling prior to placement in high volume assemblies
Ex
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