Bergquist TSP 1800 Series Self-Adhesive Thermal Interface Pad, 0.012 in Thick, 1.8 W/mK, 12 in, 12in, Silicone
- RS-stocknr.:
- 282-6865
- Fabrikantnummer:
- SIL PAD TSP 1800, 12in x 12in x 0.012 aca
- Fabrikant:
- Bergquist
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- RS-stocknr.:
- 282-6865
- Fabrikantnummer:
- SIL PAD TSP 1800, 12in x 12in x 0.012 aca
- Fabrikant:
- Bergquist
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Bergquist | |
| Product Type | Thermal Interface Pad | |
| Thickness | 0.012in | |
| Thermal Conductivity | 1.8W/mK | |
| Self-Adhesive | Yes | |
| Trade Name | TSP 1800 | |
| Conductive Material | Silicone | |
| Length | 12in | |
| Width | 12in | |
| Standards/Approvals | No | |
| Series | TSP 1800 | |
| Alles selecteren | ||
|---|---|---|
Merk Bergquist | ||
Product Type Thermal Interface Pad | ||
Thickness 0.012in | ||
Thermal Conductivity 1.8W/mK | ||
Self-Adhesive Yes | ||
Trade Name TSP 1800 | ||
Conductive Material Silicone | ||
Length 12in | ||
Width 12in | ||
Standards/Approvals No | ||
Series TSP 1800 | ||
Vrijgesteld
- Land van herkomst:
- US
The Bergquist silicone based fiberglass-reinforced thermal interface material featuring a smooth, highly compliant surface. The material features a non-tacky surface for efficient re-positioning and ease of use as well as an optional adhesive coating. It exhibits exceptional thermal performance at low and high application pressures. The material is ideal for placement between electronic power devices and a heat sink for screw and clip mounted applications.
Exceptional thermal performance at lower application pressures
Smooth and non-tacky on both sides for easy re-positioning, ease of use and assembly error reduction
Superior breakdown voltage and surface wet out values
Designed for applications where
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