TE Connectivity 1366 Way LGA Prototyping IC Socket
- RS-stocknr.:
- 478-437
- Artikelnummer Distrelec:
- 304-49-466
- Fabrikantnummer:
- 1981467-1
- Fabrikant:
- TE Connectivity
Subtotaal (1 verpakking van 6 eenheden)*
€ 254,77
(excl. BTW)
€ 308,27
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 75,00
Tijdelijk niet op voorraad
- Verzending vanaf 10 maart 2026
Heeft u meer nodig? Klik op 'Controleer leverdata' voor extra voorraad en levertijden.
Verpakking(en) | Per verpakking | Per stuk* |
|---|---|---|
| 1 + | € 254,77 | € 42,462 |
*prijsindicatie
- RS-stocknr.:
- 478-437
- Artikelnummer Distrelec:
- 304-49-466
- Fabrikantnummer:
- 1981467-1
- Fabrikant:
- TE Connectivity
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | TE Connectivity | |
| Product Type | IC Socket | |
| Package Type | LGA | |
| IC Socket Type | Prototyping Socket | |
| Number of Contacts | 1366 | |
| Standards/Approvals | China RoHS 2 Directive MIIT Order No 32, EU RoHS Directive 2011/65/EU Compliant, EU REACH Regulation (EC) No. 1907/2006, EU ELV Directive 2000/53/EC Compliant, 2016 No Restricted Materials Above Threshold | |
| Alles selecteren | ||
|---|---|---|
Merk TE Connectivity | ||
Product Type IC Socket | ||
Package Type LGA | ||
IC Socket Type Prototyping Socket | ||
Number of Contacts 1366 | ||
Standards/Approvals China RoHS 2 Directive MIIT Order No 32, EU RoHS Directive 2011/65/EU Compliant, EU REACH Regulation (EC) No. 1907/2006, EU ELV Directive 2000/53/EC Compliant, 2016 No Restricted Materials Above Threshold | ||
- Land van herkomst:
- CN
The TE Connectivity Stiffener plate assembly is meticulously designed to cater to LGA1366 processor requirements, providing robust support and stability. Engineered with precision, the product ensures that critical components remain secure during operation, thereby enhancing performance and reliability. Its construction not only addresses physical integrity but also promotes optimal thermal management. As a reliable solution for demanding applications, this assembly effectively mitigates potential risks associated with component misalignment. The clear documentation further establishes its compliance with stringent industry standards, ensuring peace of mind for users. Elevate your system's capabilities with a well-conceived accessory that seamlessly integrates into existing setups, ultimately extending the lifecycle of your hardware.
Constructed to enhance stability for LGA1366 processors
Facilitates optimal thermal management during operation
Supports secure component alignment to mitigate risks
Complies with EU RoHS and ELV directives for safety
Backed by comprehensive technical documentation
Offers an excellent solution for longevity in demanding applications
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