Infineon HybridPACK N channel-Channel IGBT Module, 300 A, 1200 V HybridPACK FS410R12A7P1BHPSA1
- RS-stocknr.:
- 762-978
- Fabrikantnummer:
- FS410R12A7P1BHPSA1
- Fabrikant:
- Infineon
Subtotaal (1 eenheid)*
€ 736,78
(excl. BTW)
€ 891,50
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
Op voorraad
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Aantal stuks | Per stuk |
|---|---|
| 1 + | € 736,78 |
*prijsindicatie
- RS-stocknr.:
- 762-978
- Fabrikantnummer:
- FS410R12A7P1BHPSA1
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Channel Type | N channel | |
| Product Type | IGBT Module | |
| Maximum Continuous Drain Current Id | 300A | |
| Maximum Drain Source Voltage Vds | 1200V | |
| Package Type | HybridPACK | |
| Series | HybridPACK | |
| Mount Type | Screw | |
| Minimum Operating Temperature | -40°C | |
| Forward Voltage Vf | 2.03V | |
| Typical Gate Charge Qg @ Vgs | 2.95μC | |
| Maximum Power Dissipation Pd | 775W | |
| Maximum Operating Temperature | 125°C | |
| Standards/Approvals | RoHS Compliant | |
| Height | 17mm | |
| Length | 122mm | |
| Automotive Standard | No | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Channel Type N channel | ||
Product Type IGBT Module | ||
Maximum Continuous Drain Current Id 300A | ||
Maximum Drain Source Voltage Vds 1200V | ||
Package Type HybridPACK | ||
Series HybridPACK | ||
Mount Type Screw | ||
Minimum Operating Temperature -40°C | ||
Forward Voltage Vf 2.03V | ||
Typical Gate Charge Qg @ Vgs 2.95μC | ||
Maximum Power Dissipation Pd 775W | ||
Maximum Operating Temperature 125°C | ||
Standards/Approvals RoHS Compliant | ||
Height 17mm | ||
Length 122mm | ||
Automotive Standard No | ||
- Land van herkomst:
- DE
The Infineon HybridPACK Drive G2 module features a voltage rating of 1200 V and current capabilities of 410 A continuous and 820 A peak. It includes an integrated temperature sensor, low VCE,sat, and low switching losses. The Compact design supports high power density with robust insulation, making it suitable for direct cooling and efficient PCB assembly.
Integrated on-chip temperature sensor
PressFIT contact technology
RoHS compliant, lead-free
UL 94 V0 module frame
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