Microchip Half Bridge mSiC N channel-Channel SiC Power Module, 151 A, 3300 V Enhancement Mode MSCSM330AM15D3NG
- RS-stocknr.:
- 854-513
- Fabrikantnummer:
- MSCSM330AM15D3NG
- Fabrikant:
- Microchip
Afbeelding representeert productcategorie
Subtotaal (1 eenheid)*
€ 461,41
(excl. BTW)
€ 558,31
(incl. BTW)
GRATIS bezorging voor bestellingen van meer dan € 90,00
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- Verzending vanaf 12 februari 2027
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Aantal stuks | Per stuk |
|---|---|
| 1 + | € 461,41 |
*prijsindicatie
- RS-stocknr.:
- 854-513
- Fabrikantnummer:
- MSCSM330AM15D3NG
- Fabrikant:
- Microchip
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Microchip | |
| Product Type | SiC Power Module | |
| Channel Type | N channel | |
| Maximum Continuous Drain Current Id | 151A | |
| Maximum Drain Source Voltage Vds | 3300V | |
| Series | mSiC | |
| Mount Type | Heatsink | |
| Channel Mode | Enhancement Mode | |
| Minimum Operating Temperature | -40°C | |
| Maximum Power Dissipation Pd | 1013W | |
| Transistor Configuration | Half Bridge | |
| Maximum Operating Temperature | 175°C | |
| Standards/Approvals | RoHS | |
| Automotive Standard | No | |
| Alles selecteren | ||
|---|---|---|
Merk Microchip | ||
Product Type SiC Power Module | ||
Channel Type N channel | ||
Maximum Continuous Drain Current Id 151A | ||
Maximum Drain Source Voltage Vds 3300V | ||
Series mSiC | ||
Mount Type Heatsink | ||
Channel Mode Enhancement Mode | ||
Minimum Operating Temperature -40°C | ||
Maximum Power Dissipation Pd 1013W | ||
Transistor Configuration Half Bridge | ||
Maximum Operating Temperature 175°C | ||
Standards/Approvals RoHS | ||
Automotive Standard No | ||
The Microchip silicon carbide power module offers a phase leg configuration to effectively control high-voltage power applications through superior efficiency and reliability.
Designed with low on-resistance for efficient operation under high temperatures
Includes a robust plastic enclosure for improved creepage and clearance
Features a Kelvin source to simplify the gate drive
Constructed with a copper baseplate for superior thermal management
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