Vishay E Type N-Channel Power MOSFET, 19 A, 650 V Depletion, 8-Pin PowerPAK 10 x 12 SIHK185N60E-T1-GE3

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Verpakkingsopties
RS-stocknr.:
252-0268
Fabrikantnummer:
SIHK185N60E-T1-GE3
Fabrikant:
Vishay
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Merk

Vishay

Channel Type

Type N

Product Type

Power MOSFET

Maximum Continuous Drain Current Id

19A

Maximum Drain Source Voltage Vds

650V

Series

E

Package Type

PowerPAK 10 x 12

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

0.16Ω

Channel Mode

Depletion

Maximum Gate Source Voltage Vgs

20V

Typical Gate Charge Qg @ Vgs

33nC

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

114W

Forward Voltage Vf

1.2V

Maximum Operating Temperature

+150°C

Width

5.15mm

Length

6.15mm

Standards/Approvals

RoHS

Automotive Standard

AEC-Q101

Vishay Series E Power MOSFET, 650V Maximum Drain Source Voltage, 19A Maximum Continuous Drain Current - SIHK185N60E-T1-GE3


This power MOSFET is a high-voltage switching device for power conversion and control in demanding electronic systems. Designed for surface mounting in Compact assemblies, it operates as an N-channel depletion-mode transistor and is suitable for applications requiring elevated temperature endurance and robust voltage handling.

Features and Benefits:


• 650V drain rating enables high-voltage switching capability • 19A continuous drain current supports substantial load handling • 0.16Ω Rds(on) minimises conduction losses for improved efficiency • 33nC typical gate charge allows predictable switching energy • 114W power dissipation manages thermal load in Compact layouts • ±20V gate tolerance simplifies gate-drive design and protection

Applications


• Suitable for high-voltage power supplies in industrial automation • Ideal for inverter stages in motor-control systems • Used for DC-DC conversion in heavy-duty electrical equipment • Can be used for switch-mode functions in power-distribution modules

What operating temperature range can it withstand?


It functions between -55°C and +150°C, enabling use in environments with wide thermal variation.

What package type is provided for PCB integration?


The device is supplied in a surface-mount PowerPAK 10x12 package with eight pins for Compact assembly.

How does the device meet automotive development needs?


It conforms to AEC-Q101 qualification, supporting designs that require automotive-grade component robustness.

What are the physical footprint dimensions?


The component measures 6.15mm in length and 5.15mm in width for space-conscious layouts.

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