Infineon XHP Dual SiC Dual N-Channel MOSFET, 1.2 kA, 1700 V Depletion Tray FF1200XTR17T2P5BPSA1
- RS-stocknr.:
- 277-191
- Fabrikantnummer:
- FF1200XTR17T2P5BPSA1
- Fabrikant:
- Infineon
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RS heeft dit product niet meer op voorraad.
- RS-stocknr.:
- 277-191
- Fabrikantnummer:
- FF1200XTR17T2P5BPSA1
- Fabrikant:
- Infineon
Specificaties
Datasheets
Wetgeving en compliance
Productomschrijving
Zoek vergelijkbare producten door een of meer kenmerken te selecteren.
Alles selecteren | Attribuut | Waarde |
|---|---|---|
| Merk | Infineon | |
| Channel Type | Dual N | |
| Maximum Continuous Drain Current | 1.2 kA | |
| Maximum Drain Source Voltage | 1700 V | |
| Package Type | Tray | |
| Series | XHP | |
| Mounting Type | Screw Mount | |
| Channel Mode | Depletion | |
| Transistor Material | SiC | |
| Number of Elements per Chip | 2 | |
| Alles selecteren | ||
|---|---|---|
Merk Infineon | ||
Channel Type Dual N | ||
Maximum Continuous Drain Current 1.2 kA | ||
Maximum Drain Source Voltage 1700 V | ||
Package Type Tray | ||
Series XHP | ||
Mounting Type Screw Mount | ||
Channel Mode Depletion | ||
Transistor Material SiC | ||
Number of Elements per Chip 2 | ||
- Land van herkomst:
- DE
The Infineon IGBT module is a XHP 2 1700 V, 1200 A dual IGBT module with .XT interconnection technology and TRENCHSTOP IGBT5 for high reliability and robustness, combined with system availability and long lifetime for high power traction and wind applications.
Copper bonds for high current carrying capabilities
Sintering of chips for highest power cycling capabilities
Less cooling effort for same output power
Enables higher system overload conditions
Sintering of chips for highest power cycling capabilities
Less cooling effort for same output power
Enables higher system overload conditions
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