Infineon BSP N-Channel MOSFET, 120 mA, 600 V Enhancement, 3-Pin SOT-223 BSP125H6433XTMA1

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€ 740,00

(excl. BTW)

€ 896,00

(incl. BTW)

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  • Verzending vanaf 01 maart 2027
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RS-stocknr.:
250-0527
Fabrikantnummer:
BSP125H6433XTMA1
Fabrikant:
Infineon
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Merk

Infineon

Product Type

MOSFET

Channel Type

N

Maximum Continuous Drain Current Id

120mA

Maximum Drain Source Voltage Vds

600V

Series

BSP

Package Type

SOT-223

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

45000mΩ

Channel Mode

Enhancement

Typical Gate Charge Qg @ Vgs

80nC

Minimum Operating Temperature

-55°C

Forward Voltage Vf

1V

Maximum Gate Source Voltage Vgs

20V

Maximum Power Dissipation Pd

81W

Maximum Operating Temperature

+150°C

Standards/Approvals

RoHS

Automotive Standard

AEC-Q101

Infineon BSP Series MOSFET, 600V Maximum Drain-Source Voltage, 81W Maximum Power Dissipation - BSP125H6433XTMA1


This MOSFET is a surface-mounted enhancement-mode N-channel device intended for high-voltage switching and power dissipation tasks in Compact electronic assemblies. It operates across a wide temperature span suited to demanding conditions and incorporates a three-pin SOT-223 package for straightforward PCB placement. The component is RoHS compliant and meets automotive qualification standards for use in regulated vehicle environments.

Features and Benefits:


• 600V drain-source rating enables high-voltage switching
• 81W power dissipation supports sustained thermal loads
• 0.12A continuous drain current suits low-current control paths
• 45,000mΩ on-resistance minimises conduction losses
• 80nC gate charge at 20V simplifies gate-drive design

Applications


• Suitable for industrial power supply switching stages
• Ideal for automotive control circuits requiring qualification
• Used with Compact converters needing SOT-223 mounting
• Can be used for high-temperature electronic modules
• Suitable for surface-mount prototype and production boards

What gate voltage limits must be observed?


The gate-source voltage must not exceed 20V to prevent gate-region damage.

What thermal range can be expected during operation?


The device is rated for continuous use from -55°C up to +150°C to accommodate wide environmental conditions.

How many pins and what package type should PCB designers allow for?


It uses a three-pin SOT-223 package suitable for surface-mount assembly and typical soldering processes.

What standards or approvals apply to this component?


It complies with RoHS directives and meets the AEC-Q101 automotive qualification.

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